Low loss impedance transformers implemented as integrated passive devices and related methods thereof

ABSTRACT

Disclosed are apparatus and methods related to low loss impedance transformers implemented as integrated passive devices (IPDs). In some embodiments, an IPD can include an autotransformer implemented within a body. The autotransformer can include primary and secondary metal traces implemented in respective planes separated by a distance. The autotransformer can be configured to, for example, facilitate impedance matching of radio-frequency (RF) signals. In some embodiments, the IPD can include a surface that allows mounting of one or more components thereon to provide space savings in RF modules. Examples of fabrication methods as well as products that can benefit from such IPDs are disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.61/817,291 filed Apr. 29, 2013, entitled DEVICES AND METHODS RELATED TOAUTOTRANSFORMERS FOR RADIO-FREQUENCY MATCHING CIRCUITS, the disclosureof which is hereby expressly incorporated by reference herein in itsentirety.

BACKGROUND

1. Field

The present disclosure generally relates to autotransformer-basedimpedance matching circuits implemented as integrated passive devices(IPDs).

2. Description of the Related Art

In radio-frequency (RF) applications, an impedance matching circuit istypically implemented between an output of a power amplifier (PA) and acircuit downstream of the output. Such a downstream circuit can include,for example, a switching circuit, a filter, a duplexer, etc., and beconfigured to route and/or condition the amplified RF signal fortransmission. The impedance matching circuit is typically configured toprovide transformation of impedance between the PA and the downstreamcircuit to thereby reduce loss of the amplified RF signal and to allowtransmission of the RF signal in an efficient manner.

SUMMARY

In some implementations, the present disclosure relates to an impedancematching device for a radio-frequency (RF) power amplifier (PA). Theimpedance matching device includes a primary metal trace having one ormore turns between a first end and a second end. The first end of theprimary metal trace is configured to be capable of being connected to avoltage source for the PA. The second end of the primary metal trace isconfigured to be capable of being connected to an output of the PA. Theimpedance matching device further includes a secondary metal tracehaving one or more turns between a first end and a second end. The firstend of the secondary metal trace is connected to the second end of theprimary metal trace. The second end of the secondary metal trace isconfigured to be capable of being connected to an output node. Theprimary metal trace and the secondary metal trace are in respectiveplanes separated by a distance.

In some embodiments, the impedance matching device can further include afirst substrate configured to support the primary metal trace. In someembodiments, the impedance matching device can further include aninsulator layer implemented between the primary metal trace and thesecondary metal trace. The insulator layer can have a thickness selectedto provide the separation distance. The impedance matching device canfurther include a conductive feature implemented through the insulatorlayer. The conductive feature can be configured to provide theconnection between the first end of the secondary metal trace and thesecond end of the primary metal trace.

In some embodiments, the impedance matching device can further include asecond substrate configured to support the secondary metal trace. Thesecond substrate with the secondary metal trace can be in a flip-mountedconfiguration with the first substrate to provide the separationdistance between the primary metal trace and the secondary metal trace.Each of the first substrate and the second substrate can include amounting surface opposite from a surface on which respective metal traceis implemented on. The mounting surface of the first substrate caninclude a plurality of contact pads configured to allow mounting of theimpedance matching device to a packaging substrate. The mounting surfaceof the second substrate can be configured to allow mounting of a diethereon. The mounting surface of the second substrate can besubstantially flat.

In some embodiments, the impedance matching device can be an integratedpassive device (IPD). In some embodiments, the primary metal trace canbe wider than the secondary metal trace. In some embodiments, theprimary metal trace can be thicker than the secondary metal trace. Theprimary metal trace can be configured to provide passage of a DC currentfor the PA. The primary metal trace can be further configured to providea low impedance path for an RF current. The secondary metal trace andits separation distance with the primary metal trace can be configuredto provide strong coupling between the primary and secondary metaltraces.

In some embodiments, the primary metal trace and the second metal tracecan be configured as an autotransformer. The impedance matching devicecan further include one or more circuit elements configured to providematching functionality on either or both sides of the autotransformer.

According to a number of implementations, the present disclosure relatesto a method for fabricating an impedance matching device. The methodincludes forming a primary metal trace. The primary metal trace has oneor more turns between a first end and a second end, with the first endof the primary metal trace configured to be capable of being connectedto a voltage source for a power amplifier (PA), and the second end ofthe primary metal trace configured to be capable of being connected toan output of the PA. The method further includes implementing asecondary metal trace relative to the primary metal trace. The secondarymetal trace has one or more turns between a first end and a second end,with the first end of the secondary metal trace connected to the secondend of the primary metal trace, and the second end of the secondarymetal trace configured to be capable of being connected to an outputnode. The primary metal trace and the secondary metal trace are inrespective planes separated by a distance.

In a number of teachings, the present disclosure relates to aradio-frequency (RF) module that includes a packaging substrateconfigured to receive a plurality of components. The RF module furtherincludes a power amplifier (PA) die implemented on the packagingsubstrate. The PA die includes an output node configured to provide anamplified RF signal. The RF module further includes an impedancematching device implemented on the packaging substrate. The impedancematching device includes a primary metal trace having one or more turnsbetween a first end and a second end. The first end of the primary metaltrace is connected to a voltage source for the PA die, and the secondend of the primary metal trace is connected to the output node of the PAdie. The impedance matching device further includes a secondary metaltrace having one or more turns between a first end and a second end. Thefirst end of the secondary metal trace is connected to the second end ofthe primary metal trace, and the second end of the secondary metal traceis connected to an output node of the impedance matching device. Theprimary metal trace and the secondary metal trace are in respectiveplanes separated by a distance.

In some embodiments, the impedance matching device can be implemented asan integrated passive device (IPD). The IPD can include a first side anda second side. The first side can be configured to facilitate mountingof the IPD on the packaging substrate, and the second side can beconfigured to allow mounting of a component to thereby yield a stackconfiguration between the IPD and the component. The first side can beconfigured to allow flip-chip mounting of the IPD on the packagingsubstrate. The second side can include a substantially flat surfacesuitable for mounting of the component. The component can include a bandselection switch device. The stack configuration can allow a reductionin lateral size of the RF module.

In some embodiments, the packaging substrate can include a laminatesubstrate. The IPD having the first and second metal traces can allowthe laminate substrate to have a reduced number of layers.

In some embodiments, the IPD can be positioned adjacent to the PA die toreduce distances associated with connections between the IPD and the PAdie. In some embodiments, the RF module can be a front-end module (FEM).

In accordance with an number of implementations, the present disclosurerelates to a wireless device that includes a transceiver configured togenerate a radio-frequency (RF) signal, and a power amplifier (PA)configured to amplify the RF signal. The wireless device furtherincludes an impedance matching device configured to impedance match theamplified RF signal. The impedance matching device includes a primarymetal trace having one or more turns between a first end and a secondend. The first end of the primary metal trace is connected to a voltagesource for the PA. The second end of the primary metal trace isconnected to an output node of the PA. The impedance matching devicefurther includes a secondary metal trace having one or more turnsbetween a first end and a second end. The first end of the secondarymetal trace is connected to the second end of the primary metal trace.The second end of the secondary metal trace is connected to an outputnode of the impedance matching device. The primary metal trace and thesecondary metal trace are in respective planes separated by a distance.The wireless device further includes an antenna in communication withthe output node of the impedance matching device. The antenna isconfigured to facilitate transmission of the amplified and matched RFsignal.

In some implementations, the present disclosure relates to an integratedpassive device (IPD) that includes a body and an autotransformerimplemented within the body. The autotransformer includes a primarymetal trace having one or more turns between a first end and a secondend, with the first end of the primary metal trace defining a firstnode, and the second end of the primary metal trace defining a tap node.The autotransformer further includes a secondary metal trace having oneor more turns between a first end and a second end, with the first endof the secondary metal trace being connected to the tap node, and thesecond end of the secondary metal trace defining a second node. Theprimary metal trace and the secondary metal trace are in respectiveplanes separated by a distance. The IPD further includes a plurality ofcontact features implemented to provide electrical connections betweenthe autotransformer and a first substrate.

In some embodiments, the first substrate can be configured to supportthe primary metal trace. The body can include a second substrateconfigured to support the second metal trace. The second substrate canbe in a flip-mounted configuration with respect to the first substrateto provide the separation distance between the primary metal trace andthe secondary metal trace. The first substrate can include a laminatesubstrate, and the second substrate can include a die substrate.

In some embodiments, the body can include a surface defined by a side ofthe second substrate opposite from a side on which the secondary metaltrace is implemented on. The surface can include a substantially flatsurface that allows mounting of one or more components thereon.

In some embodiments, the IPD can further include an insulator layerimplemented between the primary metal trace and the secondary metaltrace. The insulator layer can have a thickness selected to provide theseparation distance. The IPD can further include one or more conductivefeatures implemented through the insulator layer. The conductive featurecan be configured to provide one or more electrical connections betweenthe primary metal trace and the secondary metal trace. The insulatorlayer can include a dielectric material such as benzocyclobutene (BCB),polyimide, SiN (silicon nitride), or SiO2 (silicon dioxide).

In some embodiments, the primary metal trace can be wider than thesecondary metal trace. The primary metal trace can be thicker than thesecondary metal trace.

In some embodiments, the IPD can further include one or more circuitelements configured to provide matching functionality on either or bothsides of the autotransformer. The IPD can be an impedance matchingdevice configured to match impedance for an output of a power amplifier(PA). The primary metal trace can be configured to provide passage of aDC current for the PA. The primary metal trace can be further configuredto provide a low impedance path for an RF current. The secondary metaltrace and its separation distance with the primary metal trace can beconfigured to provide strong coupling between the primary and secondarymetal traces.

In some teachings, the present disclosure relates to a method forfabricating an integrated passive device (IPD). The method includesproviding or forming each of a first substrate and a second substrate.The method further includes implementing a primary metal trace on thefirst substrate, with the primary metal trace having one or more turnsbetween a first end and a second end. The method further includesimplementing a secondary metal trace on the second substrate, with thesecondary metal trace having one or more turns between a first end and asecond end. The method further includes flip-mounting the secondsubstrate on the first substrate to provide a desired separationdistance between the primary metal trace and the secondary metal trace.The flip-mounting includes formation of one or more electricalconnections between the primary metal trace and the secondary metaltrace to form an autotransformer.

In some embodiments, the method can further include forming an insulatorlayer between the primary metal trace and the secondary metal trace.

According to a number of implementations, the present disclosure relatesto a radio-frequency (RF) module that includes a packaging substrateconfigured to receive a plurality of components. The RF module furtherincludes a power amplifier (PA) die implemented on the packagingsubstrate. The PA die includes an output node configured to provide anamplified radio-frequency (RF) signal. The RF module further includes anintegrated passive device (IPD) implemented on the packaging substrate.The IPD is configured to receive the amplified RF signal from the PAdie. The IPD includes a body, and an autotransformer implemented withinthe body. The autotransformer is configured to facilitate impedancematching of the amplified RF signal. The RF module further includes aplurality of contact features implemented to provide electricalconnections between the autotransformer and the packaging substrate.

In some embodiments, the packaging substrate can be configured tosupport a primary metal trace of the autotransformer, and the body caninclude a die substrate configured to support a secondary metal trace ofthe autotransformer. The die substrate can be in a flip-mountedconfiguration with respect to the packaging substrate to provide theseparation distance between the primary metal trace and the secondarymetal trace. The body can include a surface defined by a side of the diesubstrate opposite from a side on which the secondary metal trace isimplemented on. The RF module can further include a component mounted onthe surface of the body in a stacked configuration. Such a component caninclude a band selection switch device. The stack configuration canallow a reduction in lateral size of the RF module.

In some embodiments, the packaging substrate can include a laminatesubstrate. The IPD having the autotransformer can allow the laminatesubstrate to have a reduced number of layers.

In some embodiments, the IPD can be positioned adjacent to the PA die toreduce distances associated with connections between the IPD and the PAdie. In some embodiments, the RF module can be a front-end module (FEM).

In a number of implementations, the present disclosure relates to awireless device having a transceiver configured to generate aradio-frequency (RF) signal, and a power amplifier (PA) configured toamplify the RF signal. The wireless device further includes an impedancematching device implemented as an integrated passive device (IPD). TheIPD is configured to receive the amplified RF signal from the PA. TheIPD includes a body and an autotransformer implemented within the body.The autotransformer is configured to facilitate impedance matching ofthe amplified RF signal. The wireless device further includes an antennain communication with the IPD. The antenna is configured to facilitatetransmission of the amplified and matched RF signal.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

The present disclosure relates to U.S. patent application No. ______[Attorney Docket 75900-50065US], titled “AUTOTRANSFORMER-BASED IMPEDANCEMATCHING CIRCUITS AND METHODS FOR RADIO-FREQUENCY APPLICATIONS,” filedon even date herewith and hereby incorporated by reference herein in itsentirety.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows that in some embodiments, a matching circuit having one ormore features of the present disclosure can be based on anautotransformer.

FIG. 2A shows that in some embodiments, a matching circuit having one ormore features described herein can be implemented as an integratedpassive device (IPD).

FIG. 2B shows that in some embodiments, a matching circuit having one ormore features described herein can be implemented partly in an IPD andpartly in a substrate.

FIG. 3 shows that in some embodiments, a matching circuit having one ormore features described herein can be implemented to match an output ofa power amplifier (PA).

FIG. 4 shows an example configuration of a conventional impedancematching circuit coupled to an output of a PA.

FIG. 5 shows an example configuration of an impedance matching circuitcoupled to an output of a PA.

FIG. 6 shows another example configuration of an impedance matchingcircuit coupled to an output of a PA.

FIGS. 7 and 8 show examples of impedance property of an autotransformerby itself.

FIGS. 9 and 10 show examples of impedance property of an autotransformerwith matching on the output side.

FIGS. 11-13 show examples of impedance property of an autotransformerwith matching on the input side.

FIG. 14 shows an example of a matching circuit having matching on theinput side and the output side of an autotransformer.

FIG. 15 shows an example configuration where the matching circuit ofFIG. 14 includes some of the inductances being provided by conductorssuch as wirebonds.

FIG. 16 shows an example configuration where an autotransformer havingtightly coupled primary and secondary coils is implemented as an IPD.

FIGS. 17A-17D show various stages of an example fabrication process forthe example IPD of FIG. 16.

FIG. 18 shows a process that can be implemented to fabricate the exampleIPD of FIGS. 16 and 17.

FIG. 19 shows another example configuration where an autotransformerhaving tightly coupled primary and secondary coils is implemented suchthat the primary coil is on a first substrate and the secondary coil ison a second substrate.

FIGS. 20A-20D show various stages of an example fabrication process forthe example IPD of FIG. 19.

FIG. 21 shows a process that can be implemented to fabricate the exampleIPD of FIGS. 19 and 20.

FIG. 22 shows examples of various design parameters associated with theexample IPD of FIGS. 19-21.

FIGS. 23A and 23B show examples of coupling coefficient K as a functionof insulator thickness at two example frequencies for various primarycoil thickness values.

FIG. 24 shows examples of insertion loss as a function of insulatorthickness for various primary coil thickness values.

FIG. 25 shows an example of how overall coil size can be designed.

FIG. 26 shows an example of how trace width of a coil can be designed.

FIG. 27 shows another example of how trace width of a coil can bedesigned.

FIG. 28 shows that in some embodiments, an autotransformer-basedmatching circuit implemented as an IPD can be configured to provide asurface for mounting one or more components thereon.

FIG. 29 shows another example of an autotransformer-based matchingcircuit implemented as an IPD so as to provide a surface for mountingone or more components thereon.

FIG. 30 shows an example IPD having one autotransformer configured in amanner similar to the example of FIG. 28.

FIG. 31 shows an example IPD having one autotransformer configured in amanner similar to the example of FIG. 29.

FIG. 32 shows that in some embodiments, an IPD can include more than oneautotransformer.

FIG. 33 shows an example configuration where another component ismounted on the surface of an IPD similar to the examples of FIGS. 28-32.

FIGS. 34A and 34B show side and plan views of connections that can beimplemented for the stacked configuration of FIG. 33.

FIGS. 35A and 35B show side and plan views of an example configurationwhere two components are mounted on the surface of an IPD similar to theexamples of FIGS. 28-32.

FIG. 36 shows an example of how the size of a module having one or morefeatures as described herein can be reduced.

FIGS. 37 and 38 show examples of how a module having one or morefeatures as described herein can allow use of a laminate substratehaving a reduced number of laminate layers.

FIG. 39 shows an example of a module that can benefit from one or morefeatures as described herein.

FIG. 40 shows an example of a wireless device that can benefit from oneor more features as described herein.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

Described herein are examples of autotransformers that can be utilizedin, for example, impedance matching circuits for radio-frequency (RF)applications. In some implementations, use of an autotransformer in animpedance matching circuit can result in significant reduction in sizeof the matching circuit. Accordingly, an area of an RF module such as amulti band multi mode front end MCM (multi-chip module) can also bereduced significantly.

In some implementations, additional benefits can be realized by use ofan autotransformer in an impedance matching circuit. For example, a needfor a DC choke in a matching circuit can be eliminated. In anotherexample, a matching circuit having an autotransformer can have a widerusable bandwidth than that of a conventional matching circuit. Althoughvarious examples are described herein in the context ofautotransformers, it will be understood that one or more features of thepresent disclosure can also be implemented in other types of transformerconfigurations, including those where first and second coils are notelectrically connected.

FIG. 1 shows that in some embodiments, one or more features of thepresent disclosure can be implemented as an autotransformer 140, andsuch an autotransformer can be implemented in a matching circuit 100.Although described in the example context of such a matching circuit, itwill be understood that one or more features of the present disclosurecan be implemented in other RF circuits.

FIG. 2A shows that in some embodiments, a matching circuit 100 or aportion of such a matching circuit having one or more features describedherein can be implemented in an integrated passive device (IPD) 102.Examples of such an implementation are described herein in greaterdetail

FIG. 2B shows that in some embodiments, a matching circuit 100 or aportion of such a matching circuit having one or more features describedherein can be implemented in an IPD 102 and a substrate 104 (e.g., alaminate packaging substrate). Examples of such an implementation aredescribed herein in greater detail.

FIG. 3 shows that in some embodiments, a matching circuit 100 having oneor more features described herein can be implemented to provideimpedance matching for an output 110 of a power amplifier (PA) 108.Although described in such an example context, it will be understoodthat the matching circuit 100 can also be implemented in otherapplications.

FIG. 4 shows an example configuration 120 of a conventional impedancematching circuit coupled to an output of an amplifying transistor 122.An RF signal is shown to be input into the base of the transistor 122,and an amplified RF signal is shown to be output through the collectorof the transistor 122. As shown, the amplified RF signal can besubjected to one or more harmonic traps, as well as a DC block, beforereaching an output node (RFOUT).

In the example configuration 120, an impedance matching circuit is shownto include a choke inductance 124. The choke inductance 124 is shown tobe implemented between a collector voltage (Vdc) node and the collectorof the transistor 122. The collector voltage node is also shown to becoupled to ground through a decoupling capacitance 126.

In the example configuration 120, the collector of the amplifyingtransistor 122 is shown to be coupled to the output node (RFOUT) throughan inductance L1 and a DC block capacitance (DC_Block). Capacitivecouplings with ground before (through capacitance C1) and after (throughcapacitance C2) the inductance L1 can be configured to provide, forexample, low pass filtering functionality for the amplified RF signal.Although the example shunts to ground involving C1 and C2 are describedin the context of capacitive shunts, it will be understood that anycombination of capacitance, inductance and resistance elements can alsobe utilized. Such shunt paths having capacitance, inductance,resistance, or any combination thereof can also be implemented in othershunt examples described herein.

FIG. 5 shows an example configuration 130 of an impedance matchingcircuit coupled to an output of an amplifying transistor 122. Similar tothe example of FIG. 4, an RF signal is shown to be input into the baseof the transistor 122, and an amplified RF signal is shown to be outputthrough the collector of the transistor 122.

The impedance matching circuit of FIG. 5 is shown to include anautotransformer 140 having a primary coil 144 and a secondary coil 148connected in series. The primary end (node 142) of the autotransformer140 is shown to be connected to a collector voltage (Vdc) node. Thesecondary end (node 150) of the autotransformer 140 is shown to beconnected to a capacitance C2 which is in turn connected to an outputnode (RFOUT). In some embodiments, C2 can be configured to resonate outleakage inductance of the autotransformer 140. In such embodiments, C2can be approximated as C2=1/[(2πf)²L_(leak)].

In FIG. 5, a capacitance C1 is shown to be connected between the Vdcnode and tap a node 146 that is between the primary coil 144 and thesecondary coil 148. In some embodiments, C1 can be configured toresonate out magnetizing inductance of the autotransformer 140. In suchembodiments, C1 can be approximated as C1=1/[(2πf)²L_(mag)].

In FIG. 5, the collector output of the transistor 122 is shown to beconnected to the tap node 146 between the primary and secondary coils144, 148. Also, a decoupling capacitance 143 is shown to terminate an RFcurrent at the Vdc node (142).

Configured in the foregoing manner, the primary coil 144 can be used topass a DC current (Vdc) of the transistor 122 as well as the RF currentof the low impedance circuit. Thus, the primary coil 144 can be re-usedin both low impedance and high impedance branches of the circuit,thereby reducing the size and electrical loss of the matching circuit.

FIG. 6 shows another example configuration 132 of an impedance matchingcircuit coupled to an output of an amplifying transistor 122. Similar tothe example of FIG. 4, an RF signal is shown to be input into the baseof the transistor 122, and an amplified RF signal is shown to be outputthrough the collector of the transistor 122.

The impedance matching circuit of FIG. 6 is shown to include anautotransformer 140 having a primary coil 144 and a secondary coil 148connected in series. The primary end (node 142) of the autotransformer140 is shown to be connected to a Vdc node. The secondary end (node 150)of the autotransformer 140 is shown to be connected to a capacitance C2which is in turn connected to an output node (RFOUT). In someembodiments, C2 can be configured to resonate out leakage inductance ofthe autotransformer 140. In such embodiments, C2 can be approximated asC2=1/[(2πf)²L_(leak)].

In FIG. 6, the collector output of the transistor 122 is shown to beconnected to a tap node 146 between the primary and secondary coils 144,148. Also, a decoupling capacitor is shown to terminate an RF current atthe Vdc node (142).

FIG. 6 shows that one or more harmonic traps can be implemented toachieve harmonic termination conditions for various classes ofoperation. For example, a primary matching capacitance C1 and aninductance (Trap_(—)2fo) are shown to be arranged in series between thetap node 146 and ground; and such an arrangement can be utilize as asecond harmonic trap. In another example, a secondary matchingcapacitance (C_(—)3fo) can be implemented between the tap node 146 andthe secondary end node 150 to block third harmonic.

FIGS. 7-15 show various non-limiting examples of design features thatcan be considered and implemented to yield desirable performance ofmatching circuits based on autotransformers. FIGS. 7 and 8 show examplesof impedance property of an autotransformer by itself. Moreparticularly, FIG. 7 shows an autotransformer 140 having a primaryinductance L1 and a secondary inductance L2. The autotransformer 140 isshown to be provided with an input (In) at a tap node between L1 and L2.An output (Out) is shown to be at an end node of L2. Accordingly, inputand output reflection coefficients S11, S22 can be characterized asshown.

FIG. 8 shows a Smith plot of impedance associated with S11 (S(1,1)) andS22 (S(2,2)) of the example of FIG. 7, as frequency is swept from 50 MHzto 10 GHz. For the Smith plot of FIG. 8, L1=1 nH, L2=16 nH, and a turnratio of 4 (e.g., N1=1, N2=4), resulting in a coupling coefficient Kc ofapproximately 0.9. It is noted that with such a configuration, highercoil loss can occur in the form of, resulting from and/or resulting in,for example, higher Re(Zin) and more Z-ratio dispersion. It is alsonoted that lower primary inductance can occur in the form of, resultingfrom and/or resulting in, for example, smaller bandwidth and higherresidual inductance. It is also noted that lower coupling efficiency canoccur in the form of, resulting from and/or resulting in, for example,lower bandwidth and higher residual inductance.

FIGS. 9 and 10 show examples of impedance property with matching of theoutput side of an autotransformer. More particularly, FIG. 9 shows anautotransformer 140 having a primary inductance L1 and a secondaryinductance L2. The autotransformer 140 is shown to be provided with aninput (In) at a tap node between L1 and L2. An output (Out) is shown tobe obtained from an end node 160 of L2 through a DC block capacitance(C_block). A shunt arm with a capacitance (C_shunt) and an inductance162 is shown to couple the node 160 with ground. Accordingly, input andoutput reflection coefficients S11, S22 of the autotransformer 140 canbe characterized as shown.

FIG. 10 shows a Smith plot of impedance associated with S11 (S(1,1)) andS22 (S(2,2)) of the example of FIG. 9, as frequency is swept from 0 Hz(DC) to 6 GHz. For the Smith plot of FIG. 10, the turn ratio between thesecondary coil (N2) and the primary coil (N1) is 3.75 (e.g., N1=1,N2=3.75). It is noted that the shunt arm (with C_shunt) and the DC blockcapacitance (C_block) can be configured to move the impedancesassociated with both S11 and S22 toward a matched impedance Zo. Forexample, the shunt arm (with C_shunt) can be configured to move theimpedances from impedance values m1 and m2 towards Zo along, forexample, an impedance profile 164. In another example, the DC blockcapacitance (C_block) can be configured to further move the impedancesresulting from the shunt arm (with C_shunt) toward Zo along, for examplean impedance profile 166.

FIGS. 11-13 show examples of impedance property with matching of theinput side of an autotransformer. More particularly, FIG. 11 shows anautotransformer 140 having a primary inductance L1 and a secondaryinductance L2. The autotransformer 140 is shown to be provided with aninput (In) through an inductance (L_series) to a tap node 170 between L1and L2. An output (Out) is shown to be at an end node of L2. A shunt armwith a capacitance (C_shunt) and an inductance 172 is shown to couplethe node 170 with ground. A capacitance C1 is shown to provide aparallel path with the primary inductance L1, between the node 170 andan end node 174 of L1. The end node 174 is shown to be coupled to groundthrough a decoupling capacitance (C_decouple). In some embodiments,either or both of the shunt capacitance (C_shunt) and the parallel-pathcapacitance (C1) can be implemented. Accordingly, input and outputreflection coefficients S11, S22 of the autotransformer 140 can becharacterized as shown.

In some embodiments, inductance for one or more of the inductances ofthe example of FIG. 11 can be provided by one or more conductor featuresbetween two nodes. For example, and as shown in FIG. 12, the inductanceL_series can be provided by an assembly of one or more wirebonds 180between conductive pads 176, 178. The conductive pad 176 can beconnected to the input node (In), and the conductive pad 178 can beconnected to the node 170. As described herein, such wirebonds can beconfigured to provide desired impedance values for various matchingfeatures implemented with autotransformers.

FIG. 13 shows a Smith plot of impedance associated with S11 (S(1,1)) andS22 (S(2,2)) of the example of FIG. 11, as frequency is swept from 0 Hz(DC) to 6 GHz. For the Smith plot of FIG. 13, the turn ratio between thesecondary coil (N2) and the primary coil (N1) is 3.75 (e.g., N1=1,N2=3.75). Similar results can be obtained for configurations each havingone of the shunt capacitance (C_shunt) and the parallel-path capacitance(C1), but not the other. It is noted that either of the shunt arm (withC_shunt) and the parallel-path capacitance (C1), and the inductance(L_series), can be configured to move the impedances associated withboth S11 and S22 toward a matched impedance Zo. For example, the shuntarm (with C_shunt) can be configured to move the impedances fromimpedance values m1 and m2 along, for example, an impedance profile 182.In another example, the inductance (L_series) can be configured tofurther move the impedances resulting from the shunt arm (with C_shunt)toward Zo along, for example an impedance profile 184.

FIG. 14 shows an example of a matching circuit with matching on both ofthe input side and the output side of an autotransformer. Such amatching circuit can include one or more features described in theexamples of FIGS. 9-13, as well as one or more features that canfacilitate combining of input-side matching and output-side matching.

In the example of FIG. 14, an autotransformer 140 having a primaryinductance L1 and a secondary inductance L2 is shown to be provided withan input (In) through an inductance (L_series) to a tap node 190 betweenL1 and L2. An output (Out) is shown to be obtained from an end node ofL2, through a capacitance C2, and an inductance L4. On the input side, ashunt arm with a capacitance C3 and an inductance L7 is shown to couplethe node 190 with ground. Also on the input side, a shunt arm with acapacitance C5 and an inductance L8 is shown to couple the input nodewith ground. On the output side, a shunt arm with a capacitance C1 andan inductance L3 is shown to couple a node 192 between C2 and L4 withground.

In the example of FIG. 14, an end node 194 of the primary inductance L1can be a supply voltage (VCC) node. Decoupling functionality can beprovided by an inductance L5 between the VCC node 194 and a decouplingcapacitance (C_decouple) which is in turn connected to ground. Acoupling path between the VCC node and ground through a capacitance C4and an inductance L6 can be configured to provide VCC bypass and primaryRF ground functionality.

In the example of FIG. 14, the input-side shunt arm with C3 and L7 canbe configured to provide primary residual tuning functionality, as wellas a trap for second harmonic. The output-side shunt arm with C1 and L3can be configured to provide output (S22) match tuning functionality, aswell as a trap for third harmonic. The capacitance C2 can be configuredto provide DC blocking and output matching functionalities.

In the example of FIG. 14, the shunt arm with C5 and L8 can beconfigured to trap second harmonic. In some embodiments, such a shuntarm can be implemented in a die that is separate from a device (e.g., anIPD) having the autotransformer 140 and related matching features.Examples related to such a device are described herein in greaterdetail.

FIG. 15 shows the same matching configuration as in the example of FIG.14, but with selected inductances provided by conductor features such aswirebonds. Such wirebonds can be implemented to provide electricalconnections between a matching circuit device 100 (e.g., an IPD) andother components or nodes outside of the device 100. For example, theinductance L_series can be implemented as one or more wirebonds toconnect the node 190 to an output of a PA (not shown). Thesecond-harmonic trap with C5 and L8, shown to be outside of the device100, can be implemented on the same die as the PA.

In other examples, inductances associated with L5, L6, L7, L4 and L4 canbe provided by respective assemblies, with each assembly having one ormore wirebonds configured to provide electrical connection between thedevice 100 and a node outside of the device 100. For example, thewirebond-assemblies associated with L7, L3 and L6 can provideconnections to grounding pads outside of the device. Thewirebond-assembly associated with L4 can provide connection of the node192 to an RF output pad outside of the device 100.

In some embodiments, some or all of matching circuits described herein(e.g., including the examples shown in FIGS. 5-15) can be implemented asan integrated passive device (IPD). FIG. 16 shows an exampleconfiguration where an autotransformer 140 having tightly coupledprimary and secondary coils 144, 148 is implemented as an IPD 200.Although not shown, other components (e.g., capacitances, inductances,conductive paths, etc.) can be included in the IPD 200.

More particularly, the IPD 200 is shown to include a die substrate 202which can be, for example, an insulating or high-resistivitysemiconductor substrate. The primary coil 144 can be implemented as oneor more turns of a metal trace 204 formed on a surface of the diesubstrate 202. The primary metal trace 204 can be configured to allowhandling of DC current of the amplifying transistor (e.g., 122 in FIGS.5 and 6) as well as RF current of the low impedance circuit.

The secondary coil 148 can be implemented as one or more turns of ametal trace 206 formed over the primary metal trace 204. In the exampleshown, the secondary metal trace 206 has multiple turns, and the primarymetal trace 204 has one turn. It will be understood that other numbersof turns for each of the primary and secondary metal traces are alsopossible. It will also be understood that each of the primary andsecondary metal traces can have non-integer number of turns, includingless than one turn.

An electrically insulating layer can be provided between the primarymetal trace 204 and the secondary metal trace 206. Thickness of such aninsulating layer can provide a separation distance between the primaryand secondary metal traces 204, 206. Accordingly, such a thickness ofthe insulating layer can be selected to provide sufficient separation,yet close enough for strong coupling between the two coils 144, 148.

As shown in FIG. 16, one end of the primary metal trace 204 can beelectrically connected to one end of the secondary metal trace 206. Forexample, suppose that a contact pad 142 (of the primary metal trace 204)is to be electrically connected to a Vdc node, and a contact pad 146(also of the primary metal trace 204) is to be electrically connected toa collector (thereby act as an input of the autotransformer). Further,suppose that a contact pad 150 (of the secondary metal trace 206) is tobe connected to an RF output (and also act as an output of theautotransformer). Then, an inner end 210 of the secondary metal trace206 can be electrically connected to the contact pad 146 by, forexample, an inter-layer conductive via 208.

As indicated in FIG. 16, a sectional view of a portion of the IPD 200 isshown in FIG. 17. More particularly, FIGS. 17A-17D show various stagesof an example IPD fabrication process. FIG. 17A shows a stage where adie substrate 202 can be provided, and a primary metal trace 204 can beformed on an upper surface of the die substrate 202. In someembodiments, the primary metal trace 204 can be formed by utilizingtechniques such as masking, metal deposition, and etching.

FIG. 17B shows a stage where an electrically insulating layer 212 can beformed so as to cover the primary metal trace 204. In some embodiments,materials such as oxide or dielectric material can be deposited so as toform the insulating layer 212.

FIG. 17C shows a stage where an opening 214 can be formed through theinsulating layer. In some embodiments, such an opening can be formed bypatterned etching, focused laser, etc.

FIG. 17D shows a stage where a secondary metal trace 208 can be formedon the insulating layer 212. In some embodiments, the secondary metaltrace 208 can be formed by utilizing techniques such as printing,masking, metal deposition, and etching. Such a formation of thesecondary metal trace 208 can result in the opening 214 (FIG. 17C) beingfilled so as to yield a conductive inter-layer via 208.

As further shown in FIG. 17D, the thickness (d1) of the insulating layer212 between the primary and secondary metal traces 204, 206 can beselected to provide sufficient separation of the metal traces, yetprovide a desirable coupling between the two metal traces.

FIG. 18 shows a process 220 that can be implemented to fabricate an IPDsuch as the example described in reference to FIGS. 16 and 17. In block222, a substrate can be provided or formed. In block 224, a first coilcan be formed on the substrate. In block 226, an insulator layer can beformed over the first coil. In block 228, a conductive feature can beformed through the insulator layer to form an electrical connection withone end of the first coil. Such a conductive feature can be formedseparately, or during the formation of a second coil. In block 230, asecond coil can be formed over the insulator layer such that one end ofthe second coil is electrically connected with the conductive feature tothereby form an autotransformer circuit. The conductive feature whichconnects the ends of the first and second coils can provide a tap nodefor the autotransformer circuit. The first coil can be configured as aprimary coil, and the second coil can be configured as a secondary coil.

In some embodiments, the tap node can be electrically connected with, orbe configured to accept an electrical connection with, an output of apower amplifier (PA) in block 232. In block 234, the other end of thesecond coil can be electrically connected with, or be configured toaccept an electrical connection with, an output of a matching circuitthat includes the autotransformer.

As described herein, such a matching circuit can include one or morecomponents or circuits for providing matching on either or both sides ofthe autotransformer. In block 236, such components or circuits that arepart of the IPD can be formed or provided to yield a desired impedancematching functionality for the IPD.

In some embodiments, some or all of matching circuits such as theexamples shown in FIGS. 5-15 can be implemented partly as an IPD, andpartly on a packaging substrate of a module 300 on which the IPD ismounted to. FIG. 19 shows an example configuration where anautotransformer 140 having primary and secondary coils 144, 148 isimplemented so that the primary coil 144 is implemented on a packagingsubstrate 302, and the secondary coil 148 is implemented on a diesubstrate 312. Although not shown, other components can also beprovided.

In the example of FIG. 19, the primary coil 144 can also be implementedon a die substrate 302 such that the module 300 includes first andsecond die (302, 312) with their respective coils (144, 148). Similarly,both of the primary and secondary coils 144, 148 can also be implementedon respective packaging substrates. Accordingly, a substrate on which acoil is implemented on can be a die substrate such as a semiconductorsubstrate, a packaging substrate such as a laminate substrate, or anycombination thereof. Thus, the module 300 can be an IPD itself, and isdescribed as such in some of the examples disclosed herein.

In the example of FIG. 19, the module 300 is shown to include the secondsubstrate 312 mounted on the first substrate 302. The second substrate312 can be, for example, an insulating or high-resistivity semiconductorsubstrate, or a laminate substrate. The first substrate 302 can be, forexample, a laminate substrate, or an insulating or high-resistivitysemiconductor substrate.

The primary coil 144 can be implemented as one or more turns of a metaltrace 304 formed on a surface of the substrate 302. The primary metaltrace 304 can be configured to allow handling of DC current of theamplifying transistor (e.g., 122 in FIGS. 5 and 6) as well as RF currentof the low impedance circuit.

The secondary coil 148 can be implemented as one or more turns of ametal trace 314 formed on a surface of the substrate 312. In the exampleshown, the secondary metal trace 314 has multiple turns, and the primarymetal trace 304 has one turn. It will be understood that other numbersof turns for each of the primary and secondary metal traces are alsopossible.

In the example shown in FIG. 19, the side of the substrate 312 on whichthe secondary metal trace 314 is formed is shown to be mounted on theside of the substrate 302 on which the primary metal trace 304 isformed. In some embodiments, such a mounting configuration can befacilitated by, for example, surface mount technology (SMT). Forexample, bumpless connections (e.g., about 25 μm stand off distance) canbe utilized to mount the secondary metal trace 314 on the primary metaltrace 304 at one or more locations. For example, a bumpless connection308 is shown to electrically connect an inner end 310 of the secondarymetal trace 314 with a contact pad 146. In another example, a bumplessconnection 322 is shown to electrically connect a contact pad 150 on anouter end of the secondary metal trace 314 with a contact pad 320 on thesubstrate 302.

In the example of FIG. 19, the contact pads 142, 146 and 320 (with 150)on the packaging substrate 302 can form the nodes as described inreference to FIGS. 5-15. As described herein, the contact pads 142, 146and 320 can be electrically connected to locations on the lower surfaceof the substrate 302.

In some implementations, an electrically insulating material can beintroduced between the primary and secondary metal traces 304, 306. Forexample, the space between the mounted secondary metal trace 306 and theprimary metal trace 304 can be under-filled with an insulating materialsuch as a dielectric material. Such a material can also fill the spacesbetween the traces of a given coil. In FIG. 19, the insulating materialbetween the primary and secondary metal traces 304, 306 is indicated asa layer 330.

As indicated in FIG. 19, a sectional view of a portion of the module/IPD300 is shown in FIG. 20. More particularly, FIGS. 20A-20D show variousstages of an example fabrication process. FIG. 20A shows a stage where afirst substrate 302 can be provided, and a primary metal trace 304 canbe formed on an upper surface of the first substrate 302. In someembodiments, the primary metal trace 304 can be formed by utilizingtechniques such as masking, metal deposition, and etching.

FIG. 20B shows a stage where a bumpless contact feature 308 can beformed on the primary metal trace 304. In some embodiments, such abumpless contact feature can be implemented using known SMT techniques.

FIG. 20C shows a stage where an assembly of a secondary metal trace 306formed on a surface of a second substrate 312 can be mounted on theprimary metal trace 304. In the example shown, the bumpless contactfeature 308 can facilitate such a mounting.

FIG. 20D shows a stage where an insulating material 330 can beintroduced between the primary metal trace 304 and the secondary metaltrace 306. Such material can be introduced by, for example,under-filling the space between the primary and secondary metal traces304, 306. In some embodiments, the insulating material 330 can be, forexample, a dielectric material.

As further shown in FIG. 20D, the distance (d2) between the primary andsecondary metal traces 304, 306 can be effectuated by, for example, thedimension of the bumpless contact feature 308. Such a distance can beselected to provide a number of features such as a desirable couplingbetween the two coils, and a desirable capacitance between the twocoils.

In some embodiments, either or both of the primary and second metaltraces 304, 306 can be configured to provide a number of desirablefeatures. For example, thickness of a given metal trace can be selectedto provide a desired insertion loss to thereby improve theautotransformer performance. In another example, other parameters suchas trace width and overall coil size can be adjusted to yield desirableperformance of the autotransformer. Examples of design considerationsbased on such parameters are described herein in greater detail.

In some embodiments, it may not be possible or practical to position theprimary and secondary metal traces 304, 306 of FIG. 20D as closely as inthe example of FIG. 17D. Accordingly, coupling efficiency may be reducedin such a situation. However, such an effect can be compensated by oneor more tuning capacitances connected to the autotransformer.

FIG. 21 shows a process 340 that can be implemented to fabricate the IPDdescribed in reference to FIGS. 19 and 20. In block 342, a firstsubstrate can be provided or formed. In block 344, a first coil can beformed on the first substrate. In some embodiments, such a coil can be aconductive trace patterned on a surface of the substrate to form aspiral shaped coil. In block 346, a conductive feature can be formed onone end of the first coil.

In block 348, a second substrate can be provided or formed. In someembodiments, the second substrate may or may not be the same type as thefirst substrate. In block 350, a second coil can be formed on the secondsubstrate. In some embodiments, such a coil can be a conductive tracepatterned on a surface of the substrate to form a spiral shaped coil.

In block 352, the second substrate with the second coil thereon can beflip mounted on the first substrate such that one end of the second coilis connected with the conductive feature. Such a connection between thefirst and second coils can form an autotransformer with a tap at theconductive feature. In block 354, an insulator layer can be formedbetween the first coil and the second coil.

In some embodiments, the tap node can be electrically connected with, orbe configured to accept an electrical connection with, an output of apower amplifier (PA). The other end of the second coil can beelectrically connected with, or be configured to accept an electricalconnection with, an output of a matching circuit that includes theautotransformer. In the various examples described in reference to FIGS.16-21, conductive features can be implemented to provide and/orfacilitate electrical connection(s) among the coils, as well as forinput/output purpose. As described herein, one or more features of thepresent disclosure can also be implemented with other types oftransformer configurations, including those where the coils are notelectrically connected with each other. For such configurations, as wellas other configurations involving other electrical connectionconfigurations, conductive features can be implemented appropriately tofacilitate electrical connections, including those for input/outputpurpose.

As described herein, such a matching circuit can include one or morecomponents or circuits for providing matching on either or both sides ofthe autotransformer. Such components or circuits that are part of theIPD can be formed or provided to yield a desired impedance matchingfunctionality for the IPD.

An IPD described in reference to FIGS. 19-21 can yield an assembly offirst and second coils 304, 314 in the form of traces depicted in across-sectional view of FIG. 22. The first coil 304 is depicted as atrace having sectional dimensions of w1 (width) and t1 (thickness). Thesecond coil 314 is depicted as a trace having sectional dimensions of w2(width) and t2 (thickness). The first and second coils 304, 314 areshown to be separated by a distance of d2, and such a gap is shown to befilled by an insulator material layer 330.

FIGS. 23-27 show examples of how some or all of the foregoing parameterscan be considered to yield desirable properties of the autotransformers.For the examples described in reference to FIGS. 23-27, the insulatorlayer 330 is formed from dielectric material such as benzocyclobutene(BCB). Other dielectric materials such as polyimide, SiN (siliconnitride), SiO2 (silicon dioxide), etc. can also be utilized as theinsulator layer 330. Further, it will be understood that other materials(e.g., polymer compounds) can also be used.

FIGS. 23A and 23B show an example of how metal thickness of a trace canbe considered as a design factor. FIG. 23A shows plots of couplingcoefficient (K) as a function of insulator (BCB) thickness (d2 in FIG.22) for various thicknesses (t1=6, 10, 14, 20 μm) of the primary trace(304), at a frequency of 850 MHz, and with the primary and secondarytrace widths (w1, w2) at 150 mμ and 40 μm, respectively. FIG. 23B showsthe same plots, but at a frequency of 1,950 MHz.

In the example of FIGS. 23A and 23B, it is noted that the couplingcoefficient K decreases monotonically with an increase in BCB thickness,as generally expected. Among the different values of the primary tracethickness (t1), the thinner primary traces appear to have slightlyhigher coupling effects than the thicker ones.

FIG. 24 shows plots of insertion loss as a function of insulator (BCB)thickness (d2 in FIG. 22) for various primary trace thicknesses (t1=6,10, 14, 20 μm), for a primary trace width w1 of 150 μm and a secondarytrace width w2 of 50 μm), at a frequency of 1,950 MHz. It is noted thatthicker primary traces in general yield lower magnitude of loss.

FIG. 25 shows plots of insertion loss as a function of primary tracewidth (w1 in FIG. 22) for various overall coil sizes (800, 1000, 1200μm) with a fixed secondary trace width (w2=45 μm), at a frequency of1,950 MHz. For these plots, the following parameters are fixed asfollows: turn ratio of (N2:N1=3.75:1), t1=6 μm, t2=6 μm, and d2 (BCB)=6μm. Such examples can be utilized to facilitate selection of designparameters such as overall coil size.

FIG. 26 shows plots of insertion loss as a function of primary tracewidth (w1 in FIG. 22) for various secondary trace widths (30, 40, 50μm), at a frequency of 1,950 MHz. For these plots, the followingparameters are fixed as follows: overall coil size=800 μm, turn ratio of(N2:N1=3.75:1), t1=6 μm, t2=6 μm, and d2 (BCB)=6 μm. It is noted thatwider second trace widths generally have lower loss magnitude. However,when the primary trace width is small, such wider second trace widthsseem to yield higher loss magnitudes. It is also noted that for a givensecond trace width, there is typically a minimum loss magnitude in theprimary trace width.

FIG. 27 shows plots of insertion loss as a function of primary tracewidth (w1 in FIG. 22) for various secondary trace widths (23, 30, 38μm), at a frequency of 1,950 MHz. For these plots, the followingparameters are fixed as follows: overall coil size=600 μm, turn ratio of(N2:N1=3.75:1), t1=6 μm, t2=6 μm, and d2 (BCB)=6 μm. Similar to the 800μm coil size example of FIG. 26, it is noted that wider second tracewidths generally have lower loss magnitude. However, when the primarytrace width is small, such wider second trace widths seem to yieldhigher loss magnitudes. It is also noted that for a given second tracewidth, there is typically a minimum loss magnitude in the primary tracewidth.

FIGS. 28-40 show various examples of how IPDs as described herein canprovide advantageous features at different levels of applications.

FIG. 28 shows an IPD 400 that is similar to the example described inreference to FIGS. 19 and 20. The IPD 400 is shown to include anautotransformer 140 having primary and secondary coils (e.g., traces)304, 314 that are spaced apart by, for example, an insulator layer suchas a BCB layer. Such an autotransformer can have its end nodes 142, 150,as well as a tap node 146 implemented as described herein. Further, suchan autotransformer can be formed by flip-mounting of one assembly(having a coil on a substrate) on another assembly (having a coil on asubstrate).

The resulting IPD 400 is shown to define a body 410 that can include thefirst and second substrates 302, 312 associated with the primary andsecondary coils 304, 314. Such a body is shown to include a firstsurface defined by a surface of the first substrate 302 opposite fromthe surface on which the primary coil 304 is implemented, and a secondsurface defined by a surface of the second substrate 312 opposite fromthe surface on which the secondary coil 314 is implemented. Whenoriented in the example manner as shown in FIG. 28, the first surface ofthe body 410 can be a lower surface for mounting to, for example, apackaging substrate of a module. The second surface of the body 410 canbe an upper surface that is substantially flat and suitable for mountingof one or more components thereon. Examples of such mounting ofcomponent(s) on the IPD 400, as well as associated advantages, aredescribed herein in greater detail.

FIG. 28 further shows that in some embodiments, appropriate connectionscan be implemented in the IPD 400 to provide electrical connectionsbetween the autotransformer 140 and contact locations on the lowersurface of the body 410. Such connections can allow the IPD 400 to bemounted on another substrate, and also leave its upper surface suitablefor mounting of one or more components. For example, conductive vias402, 404, 406 through the first substrate 302 are shown to electricallyconnect the nodes 142, 146, 150 of the autotransformer 140 with theirrespective contact locations on the lower surface of the body 410.Although such connections are depicted as direct through-substrate vias,it will be understood that other connection configurations (e.g.,through intermediate metal layer(s), offset vias, etc.) can also beimplemented.

FIG. 29 shows another example of an IPD 400 that is similar to theexample described in reference to FIGS. 19 and 20. The IPD 400 is shownto include an autotransformer 140 having primary and secondary coils(e.g., traces) 304, 314 that are spaced apart by, for example, aninsulator layer such as a BCB layer. Such an autotransformer can haveits end nodes 142, 150, as well as a tap node 146 implemented asdescribed herein. Further, such an autotransformer can be formed byflip-mounting of one assembly (having a coil on a substrate) on anotherassembly (having a coil on a substrate).

In the example of FIG. 29, the first substrate 302 can be a packagingsubstrate such as a laminate substrate, and the second substrate 312 canbe a die substrate. Configured in the foregoing manner, the coils of theautotransformer 140 can be positioned above the surface of the laminatesubstrate 302. Such a configuration can allow the laminate substrate tohave a reduced number of layers. Additionally, the die substrate withthe secondary coil being flip-mounted over the primary coil can allowthe backside of the die substrate to provide an upper surface that issubstantially flat and suitable for mounting of one or more componentsthereon. Examples of such mounting of component(s) on the IPD 400, aswell as associated advantages, are described herein in greater detail.

FIG. 30 depicts a side view of an IPD 400 similar to the example of FIG.28, with the autotransformer collectively indicated as 140. The body 410is shown to define a first surface 414 (e.g., a lower surface) on whichcontact pads 412 are formed so as to facilitate mounting of the IPD 400on another substrate. Such contact pads can be electrically connected tothe autotransformer 140 as described herein. The body 410 is shown tofurther define a second surface 416 (e.g., an upper surface). Asdescribed herein, such a surface can be suitable for mounting of one ormore components.

FIG. 31 shows a side view of an IPD 400 similar to the example of FIG.29, with the autotransformer collectively indicated as 140. The IPD 400is shown to include a primary coil 304 formed on the surface of apackaging substrate 302 such as a laminate substrate. A die substrate312 with a secondary coil 314 formed thereon is shown to be flip-mountedover the primary coil, with one or more connection features between thecoils 304, 314. An insulator layer 330 is shown to generally fill thespace between the coils 304, 314 to provide, for example, desirableautotransformer properties and support of the die substrate 312. The diesubstrate 312 mounted in the foregoing manner is shown to define asurface 416 (e.g., an upper surface). As described herein, such asurface can be suitable for mounting of one or more components.

Some of the examples of IPDs are described herein as having oneautotransformer. FIG. 32 shows that in some embodiments, more than oneautotransformer can be implemented in a given IPD. For example, FIG. 32depicts a side view of an IPD 400, with two autotransformers 140 a, 140b. Such two autotransformers can be fabricated by, for example,arranging two primary traces on a common first substrate, arranging twosecondary traces on a common second substrate, and flip-mounting onesubstrate on the other substrate as described herein.

In the example of FIG. 32, the IPD 400 is shown to define a secondsurface 416 (e.g., an upper surface). In some embodiments, such an uppersurface can be larger than the upper surface of the examples of FIGS. 30and 31, thereby providing a larger surface for mounting of one or morecomponents.

It will be understood that various IPDs described herein may or may notinclude other circuit elements. Such circuit elements can include thoseused to provide matching functionality on either or both of the inputand output sides of autotransformers.

FIGS. 33-39 show examples where one or more components are mounted on anIPD having one or more features as described herein. In some RFapplications, it can be desirable to have a band selection switch berelatively close to an output matching network (OMN) associated with apower amplifier (PA). Such OMNs are generally described herein in thecontext of matching circuits. In some embodiments, such a band selectionswitch can be stacked over an OMN that is implemented as an IPD toprovide such proximity, as well as to reduce the overall lateral area ofa module.

FIG. 33 shows that an OMN implemented as an IPD 400 can be mounted on apackaging substrate such as a laminate substrate 452, and a bandselection switch 460 can be stacked over the OMN IPD 400. FIGS. 34A and34B show side and plan views of an example configuration for theforegoing stack of the OMN IPD 400 and the band selection switch 460, aswell as electrical connections that can be formed to facilitate variousoperations.

In FIG. 33, the OMN IPD 400 is shown to be mounted on the laminatepackaging substrate 452. The band selection switch 460 is shown to bemounted on the OMN IPD 450. The OMN IPD 400 can be configured in anumber of ways, including, for example, flip-chip configuration whereelectrical connections are generally made through bump solders. Althoughdescribed in the context of such a flip-chip configuration, it will beunderstood that one or more features of the present disclosure can alsobe implemented in other configurations for the OMN IPD 400. The bandselection switch 460 can be configured in a number of ways, including,for example, as a die with wirebonding configuration where electricalconnections are generally made through wirebonds. Although described inthe context of such a wirebonding configuration, it will be understoodthat one or more features of the present disclosure can also beimplemented in other die configurations for the band selection switch460.

FIGS. 34A and 34B show side and plan views of an example configuration450 where connections among the band selection switch 460, the OMN IPD400, and the laminate substrate 452 are implemented as flip-chipconnections and wirebonds. For example, and as depicted in a simplifiedview of FIG. 34A, wirebonds 462 can be formed between the band selectionswitch 460 and the laminate substrate 452 to provide various electricalconnections. For example, the foregoing wirebond connections can beformed between contact pads 464 formed on the band selection switch die460 and contact pads 466 formed on the laminate substrate 452.Electrical connections and mechanical mounting functionality between theOMN IPD 400 and the laminate substrate 452 can be provided by bumpsolders 454.

In the example of FIGS. 33 and 34, the OMN being implemented as an IPDas described herein allows mounting of a component such as a bandselection switch. As also described herein, such a configurationprovides advantages, including reduced space occupied by suchcomponents, as well as providing close proximity between the OMN and theband selection switch.

As described herein, the flip-chip or flip-mounted configuration of theOMN IPD 400 can provide a relatively large platform for stacking, forexample a band switch die thereon. In some embodiments, there may besufficient space on such an OMN IPD to stack another device aside fromthe band switch die.

FIGS. 35A and 35B show side and plan views of an example configuration450 where a band switch 460 is mounted on an OMN IPD 400, and anadditional device is also mounted on the OMN IPD 400. In someembodiments, such an additional device can include, for example, atuning circuit 480. Such a tuning circuit can include, for example,harmonic tanks, and be implemented as a duplexer-tuning IPD. Positioningsuch an IPD above the OMN device provides additional space saving on thelaminate substrate 452.

FIG. 36 shows an example of reduction in the lateral dimensions of amodule that can result from space savings provided by stacking ofcomponent(s) as described herein. A module 500 having one or morefeatures as described herein is compared to a module 10 without suchfeatures. The module 10 is shown to have lateral dimensions of d1′×d2′;while the module 500 is shown to have reduced dimensions of d1×d2. Forexample, a multimode, multiband (MMMB) PA module without the stackingfeatures as described herein can have lateral dimensions ofapproximately 5 mm×7 mm. A PA module implemented using one or morestacking features as described herein can have lateral dimensions ofapproximately 4 mm×7 mm, which is an approximately 20% reduction inlateral size.

FIGS. 37 and 38 show another advantageous feature that can result inmodules having one or more features as described herein. FIG. 37 showsan example configuration 20 without such features, and FIG. 38 shows anexample configuration 450 with such features. More particularly, FIG. 37shows a laminate substrate 12 having, for example six laminate layers.As is generally understood, some or all of matching network circuits canbe implemented in one or more of such laminate layers. Accordingly, anexample output matching network (OMN) 22 is depicted as being part ofthe laminate substrate 12.

In FIG. 38, an OMN IPD 400 can be implemented on a laminate substrate452. Because such an OMN IPD can include some or all of the componentsand/or functionalities associated with the in-substrate portion of theOMN 22 (FIG. 37), amount of lateral space and/or layers in the laminatesubstrate can be reduced. For example, the laminate substrate 12 in theexample of FIG. 37 includes six layers; while the laminate substrate 452in the example of FIG. 38 includes four layers. Such a significantreduction in the number of laminate layers can provide a number ofadvantages, including, reduction in height of the module and reductionin costs associated with the module (e.g., cost associated with thelaminate substrate).

FIG. 39 depicts a block diagram of a module 500 that includes one ormore features as described herein. Such a module can be configured tofacilitate transmission and/or reception of RF signals. The module 500is shown to include a packaging substrate 452 configured to receive aplurality of components. Such a packaging substrate can include, forexample, a laminate substrate.

The module 500 is shown to include a PA die 470 such as a galliumarsenide (GaAs) die implemented in a heterojunction bipolar transistor(HBT) process technology. Although described in the context of HBT PAs,it will be understood that one or more features of the presentdisclosure can also be implemented in other types of PA die.

The module 500 is shown to further include a plurality of outputmatching network (OMN) IPDs 400. As described herein, a band switchcircuit can be implemented and stacked over each of the OMN IPDs 400.For example, a switch circuit die 460 is shown to be stacked over eachof the two OMN IPDs 400. In some embodiments, the OMN IPDs 400 can beconfigured to provide matching functionality for 3G/4G bands.

In some embodiments, the module 500 can further includes a matchingnetwork device 530 for 2G bands.

In FIG. 39, a plurality of filter devices and a plurality of duplexerdevices are also shown to be mounted on the packaging substrate 452. Forexample, band-pass filters and/or duplexers indicated as blocks 504,506, 510, 512, 516, 516, 518 and 520 are shown to be mounted on thepackaging substrate 452.

In some implementations, a device having one or more features describedherein can be included in an RF device such as a wireless device. Such adevice and/or a circuit can be implemented directly in the wirelessdevice, in a modular form as described herein, or in some combinationthereof. In some embodiments, such a wireless device can include, forexample, a cellular phone, a smart-phone, a hand-held wireless devicewith or without phone functionality, a wireless tablet, etc.

FIG. 40 depicts an example wireless device 600 having one or moreadvantageous features described herein. In the context of a matchingcircuit 400 having one or more features as described herein, such acircuit (e.g., in a die form, an IPD form, modular form, or somecombination thereof) can be provided, for example, to impedance matchthe outputs of a power amplifier (PA) module 616 having one or more PAs.

In the example wireless device 600, the PA module 614 can provide anamplified RF signal to a switch 622 (via the matching circuit 400 and aduplexer 620), and the switch 622 can route the amplified RF signal toan antenna 624. The PA module 616 can receive an unamplified RF signalfrom a transceiver 614 that can be configured and operated in knownmanners.

The transceiver 614 can also be configured to process received signals.Such received signals can be routed to one or more LNAs (not shown) fromthe antenna 624, through the duplexer 620.

The transceiver 614 is shown to interact with a baseband sub-system 610that is configured to provide conversion between data and/or voicesignals suitable for a user and RF signals suitable for the transceiver614. The transceiver 614 is also shown to be connected to a powermanagement component 606 that is configured to manage power for theoperation of the wireless device 600.

The baseband sub-system 610 is shown to be connected to a user interface602 to facilitate various input and output of voice and/or data providedto and received from the user. The baseband sub-system 610 can also beconnected to a memory 604 that is configured to store data and/orinstructions to facilitate the operation of the wireless device, and/orto provide storage of information for the user.

In some embodiments, one or more features of the present disclosure canbe implemented in a front-end module (FEM) 500. Such a module can havedifferent components depending on designs. For example, the FEM 500 caninclude the PAs 614, the matching circuit 400, the duplexers 620, andthe switch 622. It will be understood that greater or lesser number ofcomponents can be included in such a FEM.

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

Described herein are examples of how primary and secondary metal tracescan be implemented on an IPD, or on a packaging substrate and an IPD diesubstrate. An autotransformer is an example of how such primary andsecondary metal traces can be configured to provide a number ofadvantageous features. Although the various examples herein aredescribed in such an autotransformer context, it will be understood thatone or more features associated with the primary and secondary metaltraces can also be implemented in other applications. For example, firstand second metal traces as described herein can also be implemented as ageneral transformer, where the primary and secondary coils are spacedfrom each other and not connected electrically. In such a context,additional functionalities can be implemented. For example, a tapconnection can be provided on either of the primary and secondary coilsto sense a current flowing through the tapped coil. Such a configurationcan be utilized as, for example, a monitor for power or current of anoutput of a device such as a PA.

Further, it will be understood that while various examples of theautotransformer-based matching circuits are described in the context ofIPDs, one or more active components or circuits can also be incorporatedinto or be combined with such matching circuits. Thus, one or morefeatures of the present disclosure are not necessarily limited to IPDs.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While certain embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. An integrated passive device (IPD) comprising: abody; an autotransformer implemented within the body, theautotransformer including a primary metal trace having one or more turnsbetween a first end and a second end, the first end of the primary metaltrace defining a first node, the second end of the primary metal tracedefining a tap node, the autotransformer further including a secondarymetal trace having one or more turns between a first end and a secondend, the first end of the secondary metal trace connected to the tapnode, the second end of the secondary metal trace defining a secondnode, the primary metal trace and the secondary metal trace being inrespective planes separated by a distance; and a plurality of contactfeatures implemented to provide electrical connections between theautotransformer and a first substrate.
 2. The IPD of claim 1 wherein thebody includes a substrate configured to support the second metal trace.3. The IPD of claim 2 wherein the body includes a surface defined by aside of the substrate opposite from a side on which the secondary metaltrace is implemented on.
 4. The IPD of claim 3 wherein the surfaceincludes a substantially flat surface that allows mounting of one ormore components thereon.
 5. The IPD of claim 2 further comprising aninsulator layer implemented between the primary metal trace and thesecondary metal trace, the insulator layer having a thickness selectedto provide the separation distance.
 6. The IPD of claim 5 furthercomprising one or more conductive features implemented through theinsulator layer, the conductive feature configured to provide one ormore electrical connections between the primary metal trace and thesecondary metal trace.
 7. The IPD of claim 5 wherein the insulator layerincludes a dielectric material.
 8. The IPD of claim 7 wherein thedielectric material includes benzocyclobutene (BCB), polyimide, SiN(silicon nitride), or SiO2 (silicon dioxide).
 9. The IPD of claim 2further comprising one or more circuit elements configured to providematching functionality on either or both sides of the autotransformer.10. The IPD of claim 9 wherein the IPD is an impedance matching deviceconfigured to match impedance for an output of a power amplifier (PA).11. A method for fabricating an integrated passive device (IPD), themethod comprising: providing or forming each of a first substrate and asecond substrate; implementing a primary metal trace on the firstsubstrate, the primary metal trace having one or more turns between afirst end and a second end; implementing a secondary metal trace on thesecond substrate, the secondary metal trace having one or more turnsbetween a first end and a second end; and flip-mounting the secondsubstrate on the first substrate to provide a desired separationdistance between the primary metal trace and the secondary metal trace,the flip-mounting including formation of one or more electricalconnections between the primary metal trace and the secondary metaltrace to form an autotransformer.
 12. The method of claim 11 furthercomprising forming an insulator layer between the primary metal traceand the secondary metal trace.
 13. A radio-frequency (RF) modulecomprising: a packaging substrate configured to receive a plurality ofcomponents; a power amplifier (PA) die implemented on the packagingsubstrate, the PA die including an output node configured to provide anamplified RF signal; and an integrated passive device (IPD) implementedon the packaging substrate, the IPD configured to receive the amplifiedRF signal from the PA die, the IPD including a body, the IPD furtherincluding an autotransformer implemented within the body, theautotransformer configured to facilitate impedance matching of theamplified RF signal; and a plurality of contact features implemented toprovide electrical connections between the autotransformer and thepackaging substrate.
 14. The RF module of claim 13 wherein the packagingsubstrate is configured to support a primary metal trace of theautotransformer, and the body includes a die substrate configured tosupport a secondary metal trace of the autotransformer.
 15. The RFmodule of claim 14 wherein the die substrate is in a flip-mountedconfiguration with respect to the packaging substrate to provide theseparation distance between the primary metal trace and the secondarymetal trace.
 16. The RF module of claim 15 wherein the body includes asurface defined by a side of the die substrate opposite from a side onwhich the secondary metal trace is implemented on.
 17. The RF module ofclaim 16 further comprising a component mounted on the surface of thebody in a stacked configuration.
 18. The RF module of claim 17 whereinthe stack configuration allows a reduction in lateral size of the RFmodule.
 19. The RF module of claim 13 wherein the packaging substrateincludes a laminate substrate.
 20. The RF module of claim 19 wherein theIPD having the autotransformer allows the laminate substrate to have areduced number of layers.